Which of the following device packages is a through-hole type?

DIP stands for Dual In-line Package. It features a rectangular housing with two parallel rows of electrical connecting pins. These pins are designed to be inserted through pre-drilled holes in a printed circuit board (PCB) and soldered into place on the opposite side, making it a classic 'through-hole' component. The other options listed are all surface-mount devices (SMD), which are soldered directly to pads on the surface of the PCB. PLCC (Plastic Leaded Chip Carrier), BGA (Ball Grid Array), and SOT (Small Outline Transistor) do not have pins that pass through the board.