What advantage does surface-mount technology offer at RF compared to using through-hole components?

Surface-mount technology (SMT) eliminates the long wire leads required by traditional through-hole components. Because SMT components solder directly to pads on the surface of the printed circuit board, the components themselves can be made much smaller. This directly results in a smaller overall circuit area. Furthermore, smaller components packed closer together allow for significantly shorter circuit board traces. At radio frequencies (RF), any length of wire or trace acts as a small inductor or antenna. By virtually eliminating component leads and shortening traces, SMT drastically reduces parasitic inductance and capacitance. Because smaller circuit area, shorter traces, and reduced parasitic reactances are all direct benefits of this manufacturing technique, all of the listed choices are correct.